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ShopCamerasCooled CamerasArtemis-M Pro

Artemis-M Pro

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Artemis-M Pro

by

Player One

Manufacturer detailsOpen imaging planner

Key features

  • Sensor: Sony IMX492 mono
  • Format: 19.2 x 13.0 mm (4/3″)
  • Max Resolution: 8288 x 5648 (47 MP)
  • Pixel Size: 2.315 µm
R 24 750.00
Available to order

Estimated 14 days lead time

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Explore Artemis-M Pro

High-resolution, cooled mono sensor

A 47 megapixel, 4/3" monochrome sensor combined with deep cooling for long-exposure deep sky imaging. The Sony IMX492 sensor and Player One two-stage TEC cooler let you capture fine detail with lower noise and extended exposure capability, while the camera body includes a rear tilt plate for field flattening and filter setups.

High-resolution, cooled mono sensor

At a glance

  • 01

    Sensor: Sony IMX492 mono

  • 02

    Format: 19.2 x 13.0 mm (4/3″)

  • 03

    Max Resolution: 8288 x 5648 (47 MP)

  • 04

    Pixel Size: 2.315 µm

Sony IMX492 4/3" mono sensor for fine detail

The IMX492 sensor delivers 47 MP at 8288 x 5648 with 2.315 μm pixels on a 19.2 x 13.0 mm chip. That pixel density gives high sampling for small-scale structure in nebulae and galaxies when paired with appropriate optics.

Dual BIN modes for speed or depth

Hardware BIN1 gives full 47 MP at native 12-bit depth and about 8 FPS (RAW8). BIN2 combines pixels to produce 11.7 MP at extended 14-bit depth and higher full-well, reaching up to 33 FPS (RAW8) for faster framing or brighter targets.

Deep two-stage TEC cooling reduces noise

A two-stage thermoelectric cooler can reach about 40 °C below ambient, helping reduce thermal noise for long exposures. Cooling features include adjustable fan and anti-dew power, useful for extended imaging sessions in varying conditions.

High dynamic range and low read noise options

The camera offers large full-well capacity differences: roughly 18.6k e⁻ in BIN1 and 65.8k e⁻ in BIN2, enabling higher dynamic range in binned mode. Readout noise can fall to about 1.2 e⁻ in BIN2 HCG mode, improving faint-signal detection.

Buffer, ports and mechanical options

A 512 MB DDR3 buffer stabilizes transfers and helps avoid frame drops even on USB 2.0. The camera provides USB Type-C data ports (USB 3.0 / USB 2.0) and multiple adapters including M48 and 1.25" options, plus a front tilt plate for alignment with filters and optics.

A closer look

Artemis-M Pro
Artemis-M Pro
Artemis-M Pro
Artemis-M Pro
Specifications
ADC12-bit (BIN1), 14-bit (BIN2)
AdapterM48x0.75, 2″, 1.25″
Back Focal Length17.5 mm, 12.5 mm (without tilt plate)
Chip Size19.2 mm x 13.0 mm
Cooler Power Consumption12 V - 3 A Max
Cooling SystemHigh quality 2-stage TEC cooling Component
Data PortUSB 3.0 / USB 2.0 (Type-C)
Delta T≈40 ℃ below ambient
Diagonal23.2 mm
Diameter90 mm
Exposure Range32 µs-2000 s
Frame Rate8 FPS @ RAW8 (BIN1), 33 FPS @ RAW8 (BIN2)
Full Well18.6 k e⁻ (BIN1), 65.8 k e⁻ (BIN2)
Max Resolution8288x5648 (BIN1) / 4144x2824 (BIN2)
Pixel Size2.315 µm
Protective WindowD46 x 2 mm High Quality AR Plus Multi-Layer Coating
QE Peak≈90%
Readout Noise7.7-1.46 e⁻ (BIN1), 7.8-1.2 e⁻ (BIN2)
Resolution and FPSPerformance via USB 3.0 Connection Resolution RAW8 BIN1 RAW8 BIN2 8288x5648 8 FPS 4 FPS
SensorSony IMX492 4/3″ CMOS (mono)
ShutterRolling shutter
Total Pixels47 Mega Pixels
Weight650 g
Working Temperature & Humidity-10 ℃-60 ℃ / 0%-80%
Package contents
  • Artemis-M PRO camera + metal cover
  • M48M-M48F extender - 17.5 mm
  • M48M-M48F extender - 20 mm
  • M48M-M42F adapter - 0 mm
  • T-mount + 1.25″ cover
  • Air blower
  • Type-C to Type-A USB cable (2 m, USB 3.2)
  • Type-C to Type-C USB cable (0.5 m, USB 2.0)
  • Type-C to Type-B USB cable (0.5 m, USB 2.0)
  • M2 hex wrench + 8 x M2.5x5 screws
  • Cable tie
  • Camera bag